Application of Ultraviolet Fluorescence in Wafer Surface Cleaning Analysis

Details Application of Ultraviolet Fluorescence in Wafer Surface Cleaning Analysis Application of Ultraviolet Fluorescence in Wafer Surface Cleaning Analysis

1999-05-13

arxiv.org/abs/cond-mat/9905196v2

Physics

Condensed Matter

Materials Science

3 pages,6 figures

Scientific paper

Ultraviolet fluorescence (UVF) is introduced as a novel and versatile method for the determination of the contamination of metal impurities on silicon wafer surfaces. The results given demonstrate the usefulness of UVF for contamination control in silicon wafer processing. The experiments show some main characteristic peaks such as Fe, Cu, Ni and Na at room temperature. Compared with other surface sensitive techniques, the main advantages of UVF are low detection limits, simultaneous multi-element analysis and high sensitivity (up to 109 Fe/cm2).

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