Surfactant induced smooth and symmetric interfaces in Cu/Co multilayers

Details Surfactant induced smooth and symmetric interfaces in Cu/Co multilayers Surfactant induced smooth and symmetric interfaces in Cu/Co multilayers

2011-02-07

arxiv.org/abs/1102.1297v1

Physics

Condensed Matter

Materials Science

7 Pages, 7 Figures

Scientific paper

In this work we studied Ag surfactant induced growth of Cu/Co multilayers. The Cu/Co multilayers were deposited using Ag surfactant by ion beam sputtering technique. It was found that Ag surfactant balances the asymmetry between the surface free energy of Cu and Co. As a result, the Co-on-Cu and Cu-on-Co interfaces become sharp and symmetric and thereby improve the thermal stability of the multilayer. On the basis of obtained results, a mechanism leading to symmetric and stable interfaces in Cu/Co multilayers is discussed.

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