Carbon Nanotubes for Interconnect Applications

Details Carbon Nanotubes for Interconnect Applications Carbon Nanotubes for Interconnect Applications

2004-12-20

arxiv.org/abs/cond-mat/0412537v1

IEDM Tech. Dig., pp. 683 - 686, December 2004

Physics

Condensed Matter

Materials Science

4 pages, 11 figures

Scientific paper

We briefly review the status of the application of carbon nanotubes (CNTs) for future interconnects and present results concerning possible integration schemes. Growth of single nanotubes at lithographically defined locations (vias) has been achieved which is a prerequisite for the use of CNTs as future interconnects. For the 20 nm node, a current density of 5 10^8 A/cm^2 and a resistance of 7.8 kOhm could be achieved for a single multi-walled CNT vertical interconnect.

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