Universal Minimum Heat Leak on Low-Temperature Metallic Electrical Leads

Details Universal Minimum Heat Leak on Low-Temperature Metallic Electrical Leads Universal Minimum Heat Leak on Low-Temperature Metallic Electrical Leads

2005-08-29

arxiv.org/abs/cond-mat/0508697v2

AIP Conf. Proc. 850, "Low Temp. Phys." ed. by Y. Takano, pp. 1655-1656 (2006).

Physics

Condensed Matter

Superconductivity

Proc. Int. Low Temp. Phys. Conf. (LT24), held in Orlando, FL, Aug. 2005. 2 pages. Minor changes in notation and references in

Scientific paper

10.1063/1.2355343

Low-temperature electronic systems require electrical leads which have low electrical resistance to provide bias current I without excessive voltage drop V. But proper cryogenic design also requires high thermal resistance to maintain a minimum heat leak Q from the hot temperature T[hot] to the cold temperature T[cold]. By the Wiedemann-Franz law, these requirements are in direct conflict, and the optimal configuration takes a particularly simple universal approximate form for the common case that T[cold] << T[hot]: Q/I = V = 3.6 kT[hot]/e. This is applied here to the cryopackaging of RSFQ superconducting circuits on a 4K cryocooler, but is equally applicable to other cryogenic systems such as a superconducting sensor array at low and ultra-low temperatures.

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