Proximity effect in planar Superconductor/Semiconductor junction

Physics – Condensed Matter – Mesoscale and Nanoscale Physics

Scientific paper

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Submitted to LT22, Helsinki - August 1999, phbauth.cls included

Scientific paper

10.1016/S0921-4526(99)02865-3

We have measured the very low temperature (down to 30 mK) subgap resistance of Titanium Nitride (Superconductor, Tc = 4.6 K)/highly doped Silicon (Semiconductor) SIN junction (the insulating layer stands for the Schottky barrier). As the temperature is lowered, the resistance increases as expected in SIN junction. Around 300 mK, the resistance shows a maximum and decreases at lower temperature. This observed behavior is due to coherent backscattering towards the interface by disorder in Silicon ("Reflectionless tunneling"). This effect is also observed in the voltage dependence of the resistance (Zero Bias Anomaly) at low temperature (T<300 mK). The overall resistance behavior (in both its temperature and voltage dependence) is compared to existing theories and values for the depairing rate, the barrier resistance and the effective carrier temperature are extracted.

No associations

LandOfFree

Say what you really think

Search LandOfFree.com for scientists and scientific papers. Rate them and share your experience with other people.

Rating

Proximity effect in planar Superconductor/Semiconductor junction does not yet have a rating. At this time, there are no reviews or comments for this scientific paper.

If you have personal experience with Proximity effect in planar Superconductor/Semiconductor junction, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Proximity effect in planar Superconductor/Semiconductor junction will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFWR-SCP-O-386360

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.