Physics – Condensed Matter – Materials Science
Scientific paper
2007-09-12
Dans Proceedings of 12th International Workshop on Thermal investigations of ICs - THERMINIC 2006, Nice : France (2006)
Physics
Condensed Matter
Materials Science
Submitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions)
Scientific paper
In this paper we report on a novel simulation tool designed for the 3D coupled electro-thermal simulation of Smart Power Mosfets, that is a tool capable of taking into account not only the electrical (and thermal) behaviour of the power device but also the different driving strategies as they are imposed by a control logic circuit which usually resides on the same chip. The simulator is fully developed under Matlab and solves, self consistently, the 3D heat equation with proper boundary conditions and heat sources. An adaptive meshing algorithm based on temperature gradients and an optimized time stepping strategy have also been developed to reduce computational load and speed up simulation time without loosing accuracy. To validate this approach, simulator results are finally compared to experimental data obtained on a commercial Smart Power device used in automotive applications.
Breglio G.
Buonaiuto G.
Irace A.
Spirito P.
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