Void-induced cross slip of screw dislocations in fcc copper

Details Void-induced cross slip of screw dislocations in fcc copper Void-induced cross slip of screw dislocations in fcc copper

2007-10-31

arxiv.org/abs/0710.5811v2

Physical Review B Vol.77, 064108 (2008)

Physics

Condensed Matter

Materials Science

Scientific paper

10.1103/PhysRevB.77.064108

Pinning interaction between a screw dislocation and a void in fcc copper is investigated by means of molecular dynamics simulation. A screw dislocation bows out to undergo depinning on the original glide plane at low temperatures, where the behavior of the depinning stress is consistent with that obtained by a continuum model. If the temperature is higher than 300 K, the motion of a screw dislocation is no longer restricted to a single glide plane due to cross slip on the void surface. Several depinning mechanisms that involve multiple glide planes are found. In particular, a depinning mechanism that produces an intrinsic prismatic loop is found. We show that these complex depinning mechanisms significantly increase the depinning stress.

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