Spheroidal Particle Stability in Semi-Solid Processing

Physics – Condensed Matter – Materials Science

Scientific paper

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Scientific paper

A model for diffusion-controlled spherical particle growth is presented and solved numerically, showing how, on cooling at sufficient rate from a given fraction solid, growth velocity first increases, and then decreases rapidly when solute fields of adjacent particles overlap. An approximate analytical solution for the spherical particle growth velocity is then developed and shown to be valid until the solute fields begin to overlap. A particle stability model is next presented, building on the above analytic solution. This model permits prediction of the maximum cooling rate at which a semi-solid slurry or reheated semi-solid billet can be cooled while still retaining the spherical growth morphology. The model shows that particle stability is favored by high particle density, high fraction solid and low cooling rate. The predictions of the stability model are found to be in good quantitative agreement with experimental data collected for Al-4.5wt%Cu alloy. Engineering applications of the results obtained are discussed.

No associations

LandOfFree

Say what you really think

Search LandOfFree.com for scientists and scientific papers. Rate them and share your experience with other people.

Rating

Spheroidal Particle Stability in Semi-Solid Processing does not yet have a rating. At this time, there are no reviews or comments for this scientific paper.

If you have personal experience with Spheroidal Particle Stability in Semi-Solid Processing, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Spheroidal Particle Stability in Semi-Solid Processing will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFWR-SCP-O-45241

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.