Physics – Condensed Matter – Other Condensed Matter
Scientific paper
2004-06-30
Physics
Condensed Matter
Other Condensed Matter
17 pages, 10 figures
Scientific paper
10.1143/JPSJ.73.2135
A simple model for the peeling process of pressure-sensitive adhesive tape is presented. The model consists of linear springs and dashpots and can be solved analytically. Based on the modeling, the curved profile of the peeling tape is spontaneously determined in terms of viscoelastic properties of adhesives. Using this model, two experimental results are discussed: critical peel rates in the peel force and the peel rate dependence of the detachment process of adhesive from the substrate.
Sato Katsuhiko
Toda Akihiko
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