Mechanisms of weak thickness dependence of the critical current density in strong pinning ex situ metal-organic-deposition route YBa2Cu3O7-x coated conductors

Details Mechanisms of weak thickness dependence of the critical current density in strong pinning ex situ metal-organic-deposition route YBa2Cu3O7-x coated conductors Mechanisms of weak thickness dependence of the critical current density in strong pinning ex situ metal-organic-deposition route YBa2Cu3O7-x coated conductors

2006-05-24

arxiv.org/abs/cond-mat/0605613v1

Physics

Condensed Matter

Superconductivity

Submitted to Superconductor Science and Technology

Scientific paper

10.1088/0953-2048/19/9/013

We report on the thickness dependence of the superconducting characteristics including critical current Ic, critical current density Jc, transition temperature Tc, irreversibility field Hirr, bulk pinning force plot Fp(H), and the normal state resistivity curve measured after successive ion milling of ~ 1 um thick high Ic YBa2Cu3O7-x films made by an ex situ metal-organic deposition process on Ni-W rolling-assisted biaxially textured substrates (RABiTS). Contrary to many recent data, mostly on in situ pulsed laser deposition (PLD) films, which show strong depression of Jc with increasing film thickness t, our films exhibit only a weak dependence of Jc on t. The two better textured samples had full cross-section average Jc,avg(77K,0T) ~ 4 MA/cm2 near the buffer layer interface and ~3 MA/cm2 at full thickness, despite significant current blocking due to ~30% porosity in the film. Taking account of the thickness dependence of the porosity, we estimate that the local, vortex-pinning current density is essentially independent of thickness, while accounting for the additional current-blocking effects of grain boundaries leads to local, vortex-pinning Jc values well above 5 MA/cm2. Such high local Jc values are produced by strong three-dimensional vortex pinning which subdivides vortex lines into weakly coupled segments much shorter than the film thickness.

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