Kinetics of Electrodeposition of Silver and Copper at Template Synthesis of Nanowires

Details Kinetics of Electrodeposition of Silver and Copper at Template Synthesis of Nanowires Kinetics of Electrodeposition of Silver and Copper at Template Synthesis of Nanowires

2007-07-05

arxiv.org/abs/0707.0749v1

Physics

Condensed Matter

Mesoscale and Nanoscale Physics

6 pages, 7 figures

Scientific paper

The results of investigation of kinetics of nanopores filling into membranes from aluminum oxide (pore diameter - 200 nm, porosity ~ 50%) at electrodeposition of copper and silver are described. It is shown, that at identical quantity of electricity passed through solutions, the degree of pores filling by metal (average thickness of a deposit) is various for copper and silver deposition. Calculated (according Faraday Law) and experimental dependences of deposition rates of these metals on quantity of electricity passed at direct and pulse currents are presented. Galvanodynamic i - v dependences have been obtained at various current scanning rates. The smaller rate of deposition allows to decrease concentration limitations of electrode process and to obtain higher average thickness of metal deposits and higher filling degree. The limiting values of quantity of electricity for direct and pulse currents were determined. The average thickness of silver and copper deposits was obtained. A degree of pores filling, the morphology and chemical microanalysis were studied on cross-section of the membrane, using TESCAN SEM equipped with an Oxford Instruments INCA Enerqy EDX-system.

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