Interplay between grain boundary grooving, stress, and dealloying in the agglomeration of NiSi1-xGex films

Details Interplay between grain boundary grooving, stress, and dealloying in the agglomeration of NiSi1-xGex films Interplay between grain boundary grooving, stress, and dealloying in the agglomeration of NiSi1-xGex films

2006-05-18

arxiv.org/abs/cond-mat/0605451v1

Electrochem. Solid-State Lett., Volume 10, Issue 2, pp. H53-H55 (2007)

Physics

Condensed Matter

Materials Science

13 pages, 4 figures

Scientific paper

10.1149/1.2400726

Germanosilicides, especially those formed on compressive substrates, are less stable than silicides against agglomeration. By studying the solid-state reaction of Ni thin film on strained Si0.8Ge0.2(001), we show that nickel germanosilicide is different from nickel silicide and nickel germanide in several respects: the grains are smaller and faceted, the groove angle is sharper, and dealloying takes place. The germanium out-diffusion creates a stress in the film which favors grooving and agglomeration.

Affiliated with

Also associated with

No associations

Rating

Interplay between grain boundary grooving, stress, and dealloying in the agglomeration of NiSi1-xGex films does not yet have a rating. At this time, there are no reviews or comments for this scientific paper.

If you have personal experience with Interplay between grain boundary grooving, stress, and dealloying in the agglomeration of NiSi1-xGex films, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Interplay between grain boundary grooving, stress, and dealloying in the agglomeration of NiSi1-xGex films will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFWR-SCP-O-678053