Interfacial thermal transport in atomic junctions

Details Interfacial thermal transport in atomic junctions Interfacial thermal transport in atomic junctions

2011-01-27

arxiv.org/abs/1101.5225v1

Physical Review B 83, 064303 (2011)

Physics

Condensed Matter

Materials Science

10 pages, 13 figures. Accepted by Phys. Rev. B

Scientific paper

10.1103/PhysRevB.83.064303

We study ballistic interfacial thermal transport across atomic junctions. Exact expressions for phonon transmission coefficients are derived for thermal transport in one-junction and two-junction chains, and verified by numerical calculation based on a nonequilibrium Green's function method. For a single-junction case, we find that the phonon transmission coefficient typically decreases monotonically with increasing freqency. However, in the range between equal frequency spectrum and equal acoustic impedance, it increases first then decreases, which explains why the Kapitza resistance calculated from the acoustic mismatch model is far larger than the experimental values at low temperatures. The junction thermal conductance reaches a maximum when the interfacial coupling equals the harmonic average of the spring constants of the two semi-infinite chains. For three-dimensional junctions, in the weak coupling limit, we find that the conductance is proportional to the square of the interfacial coupling, while for intermediate coupling strength the conductance is approximately proportional to the interfacial coupling strength. For two-junction chains, the transmission coefficient oscillates with the frequency due to interference effects. The oscillations between the two envelop lines can be understood analytically, thus providing guidelines in designing phonon frequency filters.

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