Electroplating of conformal electrodes for vacuum nanogap tunnel junction

Details Electroplating of conformal electrodes for vacuum nanogap tunnel junction Electroplating of conformal electrodes for vacuum nanogap tunnel junction

2008-07-18

arxiv.org/abs/0807.2974v2

Physics

Condensed Matter

Mesoscale and Nanoscale Physics

11 pages, 7 figures, 5 tables

Scientific paper

In this study, we electroplated Cu electrode on Si substrate to achieve a large-area vacuum nanogap for thermotunnel devices. We used cathode coating, cathode rotation, asymmetric current regime, and electrolyte temperature regulation and stabilization to obtain the regular geometry of the Cu electrode and reduce its internal tension. On the first stage, we achieved Cu of 450-750 um thickness, with the thickness difference between center and perimeter as low as 7 um. Subsequently, we regulated the internal tension of the Cu to obtain the predefined surface curvature (concave or convex). For 12-mm diameter Ag/Cu, we obtained a minimum curvature of 40 nm/mm from the Ag side. Reduction of the diameter to 3 mm allowed the growth of Ag/Cu with curvature as low as of 2.5 nm/mm. It also allowed fabrication of two conformal electrodes having a nanogap of <5 nm width, over the area of 7 mmxmm. Such conformal electrodes could be used for devices based on electron tunneling.

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