Electronic cooling of a submicron-sized metallic beam

Details Electronic cooling of a submicron-sized metallic beam Electronic cooling of a submicron-sized metallic beam

2008-07-02

arxiv.org/abs/0807.0283v2

Appl. Phys. Lett. 94, 073101 (2009).

Physics

Condensed Matter

Mesoscale and Nanoscale Physics

4 pages, 3 figures

Scientific paper

10.1063/1.3080668

We demonstrate electronic cooling of a suspended AuPd island using superconductor-insulator-normal metal tunnel junctions. This was achieved by developing a simple fabrication method for reliably releasing narrow submicron sized metal beams. The process is based on reactive ion etching and uses a conducting substrate to avoid charge-up damage and is compatible with e.g. conventional e-beam lithography, shadow-angle metal deposition and oxide tunnel junctions. The devices function well and exhibit clear cooling; up to factor of two at sub-kelvin temperatures.

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