BCB Based Packaging for Low Actuation Voltage RF MEMS Devices

Details BCB Based Packaging for Low Actuation Voltage RF MEMS Devices BCB Based Packaging for Low Actuation Voltage RF MEMS Devices

2007-09-19

arxiv.org/abs/0709.3022v1

Materials Research Society Symposia Proceedings (2006) 7

Physics

Classical Physics

Scientific paper

This paper outlines the issues related to RF MEMS packaging and low actuation voltage. An original approach is presented concerning the modeling of capacitive contacts using multiphysics simulation and advanced characterization. A similar approach is used concerning packaging development where multi-physics simulations are used to optimize the process. A devoted package architecture is proposed featuring very low loss at microwave range.

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