Anomaly of Film Porosity Dependence on Deposition Rate

Details Anomaly of Film Porosity Dependence on Deposition Rate Anomaly of Film Porosity Dependence on Deposition Rate

2011-12-09

arxiv.org/abs/1112.2145v1

Physics

Condensed Matter

Materials Science

Scientific paper

This Letter reports an anomaly of film porosity dependence on deposition rate during physical vapor deposition - the porosity increases as deposition rate decreases. Using glancing angle deposition of Cu on SiO2 substrate, the authors show that the Cu film consists of well separated nanorods when the deposition rate is 1 nm/second, and that the Cu films consists of a more uniform (or lower porosity) film when the deposition rate is 6 nm/second; all other deposition conditions remain the same. This anomaly is the result of interplay among substrate non-wetting, density of Cu nuclei on the substrate, and the minimum diameter of nanorods.

Affiliated with

Also associated with

No associations

Rating

Anomaly of Film Porosity Dependence on Deposition Rate does not yet have a rating. At this time, there are no reviews or comments for this scientific paper.

If you have personal experience with Anomaly of Film Porosity Dependence on Deposition Rate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Anomaly of Film Porosity Dependence on Deposition Rate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFWR-SCP-O-44223