Physics – Condensed Matter – Materials Science
Scientific paper
2007-09-12
Dans Proceedings of 12th International Workshop on Thermal investigations of ICs - THERMINIC 2006, Nice : France (2006)
Physics
Condensed Matter
Materials Science
Submitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions)
Scientific paper
This paper presents an improved methodology to generate Compact Thermal
Models "CTMs" by using (VHDL-AMS) modeling language. This methodology makes it
possible to have Boundary Conditions Independent "BCI" CTMs for multi chip
components and systems while taking into account the nonlinear thermal
conductivity of semiconductors and other materials.
Dorkel J.-M.
Habra W.
Tounsi P.
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