A thermostable trilayer resist for niobium lift-off

Details A thermostable trilayer resist for niobium lift-off A thermostable trilayer resist for niobium lift-off

1999-09-03

arxiv.org/abs/cond-mat/9909053v1

Physics

Condensed Matter

Materials Science

6 pages, 6 eps figures, submitted to Journal of Vacuum Science and Technology B

Scientific paper

10.1116/1.591162

We have developped a novel lift-off process for fabrication of high quality superconducting submicron niobium structures. The process makes use of a thermostable polymer with a high transition temperature T_{g}= 235 C and an excellent chemical stability. The superconducting critical temperature of 100 nm wide niobium lines is above 7 K. An example of shadow evaporation of a Nb-Cu submicron hybrid structure is given. A potential application of this process is the fabrication of very small single electron devices using refratory metals.

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