A simple microscopic model for the dynamics of adhesive failure

Details A simple microscopic model for the dynamics of adhesive failure A simple microscopic model for the dynamics of adhesive failure

2005-06-28

arxiv.org/abs/cond-mat/0506717v2

Langmuir, 22 (2006) pp. 163--168

Physics

Condensed Matter

Soft Condensed Matter

11 pages, 5 figures

Scientific paper

10.1021/la0517282

We consider a microscopic model for the failure of soft adhesives in tension based on ideas of bond rupture under dynamic loading. Focusing on adhesive failure under loading at constant velocity, we demonstrate that bi-modal curves of stress against strain may occur due to effects of finite polymer chain or bond length and characterise the loading conditions under which such bi-modal behaviour is observed. The results of this analysis are in qualitative agreement with experiments performed on unconfined adhesives in which failure does not occur by cavitation.

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