A Model for Conductive Percolation in Ordered Nanowire Arrays

Physics – Condensed Matter – Materials Science

Scientific paper

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

5 pages, 8 figures

Scientific paper

10.1063/1.3080132

The combined processes of anodization and electrodeposition lead to highly ordered arrays of cylindrical nanowires. This template-based self-assembly fabrication method yields nanowires embedded in alumina. Commonly, chemical etching is used to remove the alumina and free the nanowires. However, it has been experimentally observed during the etching process that the nanowires tend to form clumps. In this work, the nanowires are modeled as elastic rods subject to surface interaction forces. The dynamics of the model give rise to the aforementioned clumping behavior which is studied via percolation theory. This work finds that percolation takes place with probability $P \sim (t-t_c)^x$, where the exponent $x = 2.8$ and $t_c$ is the time at which percolation takes place. The critical exponents which entirely determine the system are found to be for (dimension) $d = 2$, $\beta = 2.1, \gamma = 0.57, \Delta = 2.7, \alpha = -2.8, \nu = 2.4,$ and $\delta = 1.3$.

No associations

LandOfFree

Say what you really think

Search LandOfFree.com for scientists and scientific papers. Rate them and share your experience with other people.

Rating

A Model for Conductive Percolation in Ordered Nanowire Arrays does not yet have a rating. At this time, there are no reviews or comments for this scientific paper.

If you have personal experience with A Model for Conductive Percolation in Ordered Nanowire Arrays, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and A Model for Conductive Percolation in Ordered Nanowire Arrays will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFWR-SCP-O-351786

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.