A combination of capillary assembly and dielectrophoresis for wafer scale integration of carbon nanotubes-based electrical and mechanical devices

Details A combination of capillary assembly and dielectrophoresis for wafer scale integration of carbon nanotubes-based electrical and mechanical devices A combination of capillary assembly and dielectrophoresis for wafer scale integration of carbon nanotubes-based electrical and mechanical devices

2011-09-28

arxiv.org/abs/1109.6268v1

Physics

Condensed Matter

Materials Science

20 pages, 5 figures

Scientific paper

The wafer scale integration of carbon nanotubes (CNT) remains a challenge for electronic and electromechanical applications. We propose a novel CNT integration process relying on the combination of controlled capillary assembly and buried electrode dielectrophoresis (DEP). This process enables to monitor the precise spatial localization of a high density of CNTs and their alignment in a pre-defined direction. Large arrays of independent and low resistivity (4.4 x 10^-5 {\Omega}.m) interconnections were achieved using this hybrid assembly with double-walled carbon nanotubes (DWNT). Finally, arrays of suspended individual CNT carpets have been realized and we demonstrate their potential use as functional nano-electromechanical systems (NEMS) by monitoring their resonance frequencies (ranging between 1.7 MHz to 10.5MHz) using a Fabry-Perot interferometer.

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