Noncontact electrical metrology of Cu/low-k interconnect for semiconductor production wafers

Details Noncontact electrical metrology of Cu/low-k interconnect for semiconductor production wafers Noncontact electrical metrology of Cu/low-k interconnect for semiconductor production wafers

2011-08-10

arxiv.org/abs/1108.2225v1

Appl.Phys.Lett.88:262901,2006

Physics

Condensed Matter

Materials Science

Scientific paper

10.1063/1.2216898

We have demonstrated a technique capable of in-line measurement of dielectric constant of low-k interconnect films on patterned wafers utilizing a test key of ~50x50 \mu m in size. The test key consists of a low-k film backed by a Cu grid with >50% metal pattern density and <250 nm pitch, which is fully compatible with the existing dual-damascene interconnect manufacturing processes. The technique is based on a near-field scanned microwave probe and is noncontact, noninvasive, and requires no electrical contact to or grounding of the wafer under test. It yields <0.3% precision and 2% accuracy for the film dielectric constant.

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