Physics – Condensed Matter – Materials Science
Scientific paper
2007-09-12
Dans Proceedings of 12th International Workshop on Thermal investigations of ICs - THERMINIC 2006, Nice : France (2006)
Physics
Condensed Matter
Materials Science
Submitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions)
Scientific paper
We will describe the thermal performance of power semiconductor module, which consists of hetero-junction bipolar transistors (HBTs), for mobile communication systems. We calculate the thermal resistance between the HBT fingers and the bottom surface of a multi-layer printed circuit board (PCB) using a finite element method (FEM). We applied a steady state analysis to evaluate the influence of design parameters on thermal resistance of the module. We found that the thickness of GaAs substrate, the thickness of multi-layer circuit board, the thermal conductivity of bonding material under GaAs substrate, and misalignment of thermal vias between each layer of PCB are the dominant parameter in thermal resistance of the module.
No associations
LandOfFree
Thermal Design of Power Semiconductor Modules for Mobile Communication Systems does not yet have a rating. At this time, there are no reviews or comments for this scientific paper.
If you have personal experience with Thermal Design of Power Semiconductor Modules for Mobile Communication Systems, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermal Design of Power Semiconductor Modules for Mobile Communication Systems will most certainly appreciate the feedback.
Profile ID: LFWR-SCP-O-22692