Condensation and growth of Kirkendall voids in intermetallic compounds

Details Condensation and growth of Kirkendall voids in intermetallic compounds Condensation and growth of Kirkendall voids in intermetallic compounds

2008-03-03

arxiv.org/abs/0803.0196v1

Physics

Condensed Matter

Materials Science

11 pages, 13 Figures, 2 Tables, submitted to Elsevier

Scientific paper

A model for the simulation of Kirkendall voiding in metallic materials is presented based on vacancy diffusion, elastic-plastic and rate-dependent deformation of spherical voids. Starting with a phenomenological explanation of the Kirkendall effect we briefly discuss the consequences on the reliability of microelectronics. A constitutive model for void nucleation and growth is presented, which can be used to predict the temporal development of voids in solder joints during thermal cycling. We end with exemplary numerical studies and discuss the potential of the results for the failure analysis of joining connections.

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