The Hot-Spot Phenomenon and its Countermeasures in Bipolar Power Transistors by Analytical Electro-Thermal Simulation

Details The Hot-Spot Phenomenon and its Countermeasures in Bipolar Power Transistors by Analytical Electro-Thermal Simulation The Hot-Spot Phenomenon and its Countermeasures in Bipolar Power Transistors by Analytical Electro-Thermal Simulation

2007-09-12

arxiv.org/abs/0709.1831v1

Dans Proceedings of 12th International Workshop on Thermal investigations of ICs - THERMINIC 2006, Nice : France (2006)

Physics

Condensed Matter

Materials Science

Submitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions)

Scientific paper

This communication deals with a theoretical study of the hot spot onset (HSO) in cellular bipolar power transistors. This well-known phenomenon consists of a current crowding within few cells occurring for high power conditions, which significantly decreases the forward safe operating area (FSOA) of the device. The study was performed on a virtual sample by means of a fast, fully analytical electro-thermal simulator operating in the steady state regime and under the condition of imposed input base current. The purpose was to study the dependence of the phenomenon on several thermal and geometrical factors and to test suitable countermeasures able to impinge this phenomenon at higher biases or to completely eliminate it. The power threshold of HSO and its localization within the silicon die were observed as a function of the electrical bias conditions as for instance the collector voltage, the equivalent thermal resistance of the assembling structure underlying the silicon die, the value of the ballasting resistances purposely added in the emitter metal interconnections and the thickness of the copper heat spreader placed on the die top just to the aim of making more uniform the temperature of the silicon surface.

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