Computer simulated heat flow dynamics in Silicon at low temperatures

Details Computer simulated heat flow dynamics in Silicon at low temperatures Computer simulated heat flow dynamics in Silicon at low temperatures

2007-08-30

arxiv.org/abs/0708.4080v1

Physics

Condensed Matter

Materials Science

8 pages, 5 figures

Scientific paper

The thermal characteristics of silicon between 15 and 300 deg K are investigated by applying a computer program on the solution of the differential heat diffusion equation. The computer model is linked to high-purity silicon through a set of experimental data. The numerical results are given in graphic form and show, in particular, very short diffusion transit times across long distances. The computed figures require experimental confrontations; a test set-up is proposed.

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