Physics – General Physics
Scientific paper
2008-01-07
Dans 13th International Worshop on THERMal INvestigations of ICs and Systems - THERMINIC 2007, Budapest : Hongrie (2007)
Physics
General Physics
Submitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions)
Scientific paper
Heat generation from electronics increases with the advent of high-density integrated circuit technology. To come up with the heat generation, microscale cooling has been thought as a promising technology. Prediction of heat transfer rate is crucial in design of microscale cooling device but is not clearly understood yet. This work proposes a new correlation between heat transfer rate and Brinkman number which is nondimensional number of viscosity, flow velocity and temperature. It is expected that the equation proposed by this work can be useful to design microchannel cooling device.
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