Front-End electronics and integration of ATLAS pixel modules

Details Front-End electronics and integration of ATLAS pixel modules Front-End electronics and integration of ATLAS pixel modules

2004-01-21

arxiv.org/abs/physics/0401106v1

Nucl.Instrum.Meth.A549:157-164,2005

Physics

Instrumentation and Detectors

Talk at the VERTEX2003 conference, Lake Windermere, UK, September 2003, 8 pages, LaTeX, 6 eps figures

Scientific paper

10.1016/j.nima.2005.04.045

For the ATLAS Pixel Detector fast readout electronics has been successfully developed and tested. Main attention was given to the ability to detect small charges in the order of 5,000 electrons within 25 ns in the harsh radiation environment of LHC together with the challenge to cope with the huge amount of data generated by the 80 millions channels of the Pixel detector. For the integration of the 50 micron pitch hybrid pixel detector reliable bump bonding techniques using either lead-tin or indium bumps has been developed and has been successfully tested for large scale production.

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