Origin of Surface Defects in PCB Final Finishes by the Electroless Nickel Immersion Gold Process

Details Origin of Surface Defects in PCB Final Finishes by the Electroless Nickel Immersion Gold Process Origin of Surface Defects in PCB Final Finishes by the Electroless Nickel Immersion Gold Process

Apr 2008

adsabs.harvard.edu/cgi-bin/nph-data_query?bibcode=2008jemat..37..527k&link_type=ejournal

Journal of Electronic Materials, Volume 37, Issue 4, pp.527-534

Physics

5

Surface Defects, Black Pad Defects, Electroless Nickel Immersion Gold, Final Finishes, Pcb, Joint Failures, Hypercorrosion Defects

Scientific paper

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