Atomic layer deposition/molecular layer deposition for packaging and interconnect of N/MEMS

Details Atomic layer deposition/molecular layer deposition for packaging and interconnect of N/MEMS Atomic layer deposition/molecular layer deposition for packaging and interconnect of N/MEMS

Feb 2011

adsabs.harvard.edu/cgi-bin/nph-data_query?bibcode=2011spie.7928e...1l&link_type=abstract

Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices X. Edited by Garcia-Blanco, Sonia; Ramesham,

Physics

Scientific paper

Atomic layer deposition (ALD)/molecular layer deposition (MLD) processes are able to fabricate nano-scaled inorganic/organic multilayers. Such multilayers are essential to novel packaging and interconnect technologies for NEMS/MEMS. ALD/MLD coatings could reduce water vapor transmission rate down to 5X10-5 g/m2/day or lower for excellent hermetic/vacuum sealing. ALD/MLD coatings can also modify nanowire/nanomesh structures critical to flexible thermal ground planes that can reach an effective thermal conductivity of 30,000 W/mK and heat flux removal of 200 W/cm2. ALD/MLD coatings can enhance the stability while reducing thickness of an embedded Li-ion battery. In addition, the ALD/MLD-based inorganic/organic multilayer can be used for interconnecting nanowire-based photonics.

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