Very Fast Chip-level Thermal Analysis

Details Very Fast Chip-level Thermal Analysis Very Fast Chip-level Thermal Analysis

2008-01-07

arxiv.org/abs/0801.1056v1

Dans 13th International Worshop on THERMal INvestigations of ICs and Systems - THERMINIC 2007, Budapest : Hongrie (2007)

Physics

General Physics

Submitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions)

Scientific paper

We present a new technique of VLSI chip-level thermal analysis. We extend a newly developed method of solving two dimensional Laplace equations to thermal analysis of four adjacent materials on a mother board. We implement our technique in C and compare its performance to that of a commercial CAD tool. Our experimental results show that our program runs 5.8 and 8.9 times faster while keeping smaller residuals by 5 and 1 order of magnitude, respectively.

Affiliated with

Also associated with

No associations

Rating

Very Fast Chip-level Thermal Analysis does not yet have a rating. At this time, there are no reviews or comments for this scientific paper.

If you have personal experience with Very Fast Chip-level Thermal Analysis, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Very Fast Chip-level Thermal Analysis will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFWR-SCP-O-654842