Other
Scientific paper
Jul 1985
adsabs.harvard.edu/cgi-bin/nph-data_query?bibcode=1985e%26psl..74..275v&link_type=abstract
Earth and Planetary Science Letters, Volume 74, Issue 2-3, p. 275-279.
Other
10
Scientific paper
During the last ten years the transient hot-wire method for measuring thermal conductivity of ocean bottom muds and other soft materials has been adapted for measuring the conductivity of solid rocks because it is cheaper and quicker than the steady state methods such as the divided bar. This is done by embedding the hot wire in the form of a hypodermic needle or a ribbon flush into the surface of a block of a poorly conducting material. When a flat surface of a specimen is placed on the surface of such a sensor, the line source can be said to diffuse heat into an infinite half-space if one neglects the heat absorbed by the poorly conducting block into which the needle is embedded. The rate of the temperature rise of the line source with respect to the logarithm of time elapsed since turning on the heater is inversely proportional to the conductivity. In practice the rates of temperature rise are compared for the unknown and for a standard specimen, a fused silica plate in our case. The percentage of the total heat flowing into the sensor block is in general different for the standard and for the unknown, thus possibly creating an error when the conductivity of the sensor block is neglected. It was determined experimentally that the temperature rise for a silica plate is decreased only by 1.3% by the heat absorbed by the material of the sensor block. An empirical equation is proposed to correct errors arising from this source. This correction needs to be used only for materials of conductivity less than 2 mcal/cm °C s. The equation gives somewhat larger but still acceptable conductivity values for substances in the range of 0.208-3.25 mcal/cm°C s as shown in Table 1 and Fig. 2. For measurements on common rocks corrections for the heat diffused into the material of the sensor block can be neglected.
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