The influence of nanoscale morphology on the resistivity of cluster-assembled nanostructured metallic thin films

Details The influence of nanoscale morphology on the resistivity of cluster-assembled nanostructured metallic thin films The influence of nanoscale morphology on the resistivity of cluster-assembled nanostructured metallic thin films

Jul 2010

adsabs.harvard.edu/cgi-bin/nph-data_query?bibcode=2010njph...12g3001b&link_type=abstract

New Journal of Physics, Volume 12, Issue 7, pp. 073001 (2010).

Physics

1

Scientific paper

We have studied in situ the evolution of the electrical resistivity of Fe, Pd, Nb, W and Mo cluster-assembled films during their growth by supersonic cluster beam deposition. We observed resistivity of cluster-assembled films several orders of magnitude larger than the bulk, as well as an increase in resistivity by increasing the film thickness in contrast to what was observed for atom-assembled metallic films. This suggests that the nanoscale morphological features typical of ballistic films growth, such as the minimal cluster-cluster interconnection and the evolution of surface roughness with thickness, are responsible for the observed behaviour.

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