Tailoring of the Metal-N/P-Type GaSb Interface Properties for Device Production

Details Tailoring of the Metal-N/P-Type GaSb Interface Properties for Device Production Tailoring of the Metal-N/P-Type GaSb Interface Properties for Device Production

Apr 2007

adsabs.harvard.edu/cgi-bin/nph-data_query?bibcode=2007aipc..899..289v&link_type=abstract

SIXTH INTERNATIONAL CONFERENCE OF THE BALKAN PHYSICAL UNION. AIP Conference Proceedings, Volume 899, pp. 289-290 (2007).

Physics

Iii-V Semiconductor-To-Semiconductor Contacts, P-N Junctions, And Heterojunctions, Point Defects And Defect Clusters, Semiconductor Devices, Deposition By Sputtering, Cold Working, Work Hardening, Annealing, Post-Deformation Annealing, Quenching, Tempering Recovery, And Crystallization

Scientific paper

There are some difficulties in producing Schottky barriers (SB) to p-type GaSb and ohmic contacts (OC) to n-type GaSb connected with the physical nature of the GaSb itself. By applying low energy Ar ion sputtering at 200-700V and (NH4)2S solution treatment of the p-type substrates we achieved a rectifying behavior of the p-GaSb/Pd contacts. The same procedure combined with a proper annealing led to the production of good n-GaSb/Pd/Ge/Au ohmic contacts. The electrical behavior of the SB and OC is inferred from their current-voltage characteristics on specially prepared diode structures. SEM and TEM investigations are conducted to specify the surface and interface reactions during the processing. We interpret these results in terms of the generation of such a Ga to Sb vacancy concentration ratio during the ion sputtering that enhances the incorporation of Ge and S as donor impurities in the GaSb surface.

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