On-chip analog-to-digital conversion for cooled infrared detector arrays

Details On-chip analog-to-digital conversion for cooled infrared detector arrays On-chip analog-to-digital conversion for cooled infrared detector arrays

Jul 2000

adsabs.harvard.edu/cgi-bin/nph-data_query?bibcode=2000spie.4028..183m&link_type=abstract

Proc. SPIE Vol. 4028, p. 183-191, Infrared Detectors and Focal Plane Arrays VI, Eustace L. Dereniak; Robert E. Sampson; Eds.

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Scientific paper

As CMOS technology evolves, more and more functions can be integrated on the infrared focal plane array (FPA). This paper presents a study on the integration of analog to digital (A/D) conversion onto the FPA. A possible application for this is high-resolution (640 X 480 pixels) quantum well infrared photodetector (QWIP) FPAs operating at 70K. Operation at liquid nitrogen temperatures and below gives both advantages and disadvantages. CMOS transistors are performing better at these temperatures: increased transconductance and no leakage currents. On the other hand power dissipation needs to be limited to prevent a high load on the cooling system. The system aspects will ultimately determine the requirements for the A/D converters on the FPA. Some of the most stringent requirements are on: power dissipation, number of bits, die area and throughput. An FPA lends itself very well for the utilization of parallelism, so a trade-off can be made between sample rate per A/D converter and number of converters. With all these parameters in mind, an overview of state-of-the-art A/D converters at room temperature will be given. Trends will be identified and different architectures like delta/sigma and successive approximation will be evaluated. Also different implementation technologies such as switched current and switched capacitor will be reviewed with respect to their applicability in our application.

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