Multi-layer atom chips for versatile atom micro manipulation

Details Multi-layer atom chips for versatile atom micro manipulation Multi-layer atom chips for versatile atom micro manipulation

2008-01-22

arxiv.org/abs/0801.3351v1

Appl. Phys. Lett. 92, 254102 (2008)

Physics

Atomic Physics

4 pages, 5 figures

Scientific paper

10.1063/1.2945893

We employ a combination of optical UV- and electron-beam-lithography to create an atom chip combining sub-micron wire structures with larger conventional wires on a single substrate. The new multi-layer fabrication enables crossed wire configurations, greatly enhancing the flexibility in designing potentials for ultra cold quantum gases and Bose-Einstein condensates. Large current densities of >6 x 10^7 A/cm^2 and high voltages of up to 65 V across 0.3 micron gaps are supported by even the smallest wire structures. We experimentally demonstrate the flexibility of the next generation atom chip by producing Bose-Einstein condensates in magnetic traps created by a combination of wires involving all different fabrication methods and structure sizes.

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