Modeling Interconnect Variability Using Efficient Parametric Model Order Reduction

Computer Science – Hardware Architecture

Scientific paper

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Submitted on behalf of EDAA (http://www.edaa.com/)

Scientific paper

Assessing IC manufacturing process fluctuations and their impacts on IC interconnect performance has become unavoidable for modern DSM designs. However, the construction of parametric interconnect models is often hampered by the rapid increase in computational cost and model complexity. In this paper we present an efficient yet accurate parametric model order reduction algorithm for addressing the variability of IC interconnect performance. The efficiency of the approach lies in a novel combination of low-rank matrix approximation and multi-parameter moment matching. The complexity of the proposed parametric model order reduction is as low as that of a standard Krylov subspace method when applied to a nominal system. Under the projection-based framework, our algorithm also preserves the passivity of the resulting parametric models.

No associations

LandOfFree

Say what you really think

Search LandOfFree.com for scientists and scientific papers. Rate them and share your experience with other people.

Rating

Modeling Interconnect Variability Using Efficient Parametric Model Order Reduction does not yet have a rating. At this time, there are no reviews or comments for this scientific paper.

If you have personal experience with Modeling Interconnect Variability Using Efficient Parametric Model Order Reduction, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Modeling Interconnect Variability Using Efficient Parametric Model Order Reduction will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFWR-SCP-O-431645

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.