Long linear HgCdTe arrays with superior temperature cycling reliability

Details Long linear HgCdTe arrays with superior temperature cycling reliability Long linear HgCdTe arrays with superior temperature cycling reliability

Jul 2000

adsabs.harvard.edu/cgi-bin/nph-data_query?bibcode=2000spie.4028..380z&link_type=abstract

Proc. SPIE Vol. 4028, p. 380-389, Infrared Detectors and Focal Plane Arrays VI, Eustace L. Dereniak; Robert E. Sampson; Eds.

Physics

1

Scientific paper

To meet the demands for high temperature-cycling reliability of HgCdTe detectors, bonded to a Silicon 'Read-Out-Integrated- Circuit,' AIM has developed a Multi-Chip-Module approach for the infrared Focal-Plane-Array. Bonding of detector array and Si-chips on a sapphire substrate minimizes thermal stress and strain in the FPA, leading to cycle-to-failure of >= 1000. For maximum cycle estimation under varying strain, a correlation was established empirically.

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