Impact of Cracking beneath Solder Pads in Printed Board Laminate on Reliability of Solder Joints to Ceramic Ball Grid Array Packages

Details Impact of Cracking beneath Solder Pads in Printed Board Laminate on Reliability of Solder Joints to Ceramic Ball Grid Array Packages Impact of Cracking beneath Solder Pads in Printed Board Laminate on Reliability of Solder Joints to Ceramic Ball Grid Array Packages

Mar 2003

adsabs.harvard.edu/cgi-bin/nph-data_query?bibcode=2003esasm.267.....t&link_type=openurl

Impact of Cracking beneath Solder Pads in Printed Board Laminate on Reliability of Solder Joints to Ceramic Ball Grid Array Pack

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