High Performance Thermal Interface Technology Overview

Details High Performance Thermal Interface Technology Overview High Performance Thermal Interface Technology Overview

2008-01-07

arxiv.org/abs/0801.1046v1

Dans 13th International Worshop on THERMal INvestigations of ICs and Systems - THERMINIC 2007, Budapest : Hongrie (2007)

Physics

General Physics

Submitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions)

Scientific paper

An overview on recent developments in thermal interfaces is given with a focus on a novel thermal interface technology that allows the formation of 2-3 times thinner bondlines with strongly improved thermal properties at lower assembly pressures. This is achieved using nested hierarchical surface channels to control the particle stacking with highly particle-filled materials. Reliability testing with thermal cycling has also demonstrated a decrease in thermal resistance after extended times with longer overall lifetime compared to a flat interface.

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