Heating rate and spin flip lifetime due to near field noise in layered superconducting atom chips

Details Heating rate and spin flip lifetime due to near field noise in layered superconducting atom chips Heating rate and spin flip lifetime due to near field noise in layered superconducting atom chips

2009-12-11

arxiv.org/abs/0912.2183v1

J. Phys. B: At. Mol. Opt. Phys. 43 (2010) 095002

Physics

Atomic Physics

7 pages, 7 figures

Scientific paper

10.1088/0953-4075/43/9/095002

We theoretically investigate the heating rate and spin flip lifetimes due to near field noise for atoms trapped close to layered superconducting structures. In particular, we compare the case of a gold layer deposited above a superconductor with the case of a bare superconductor. We study a niobium-based and a YBCO-based chip. For both niobium and YBCO chips at a temperature of 4.2 K, we find that the deposition of the gold layer can have a significant impact on the heating rate and spin flip lifetime, as a result of the increase of the near field noise. At a chip temperature of 77 K, this effect is less pronounced for the YBCO chip.

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