Physics
Scientific paper
Aug 2009
adsabs.harvard.edu/cgi-bin/nph-data_query?bibcode=2009spie.7458e...9w&link_type=abstract
Remote Sensing System Engineering II. Edited by Ardanuy, Philip E.; Puschell, Jeffery J.. Proceedings of the SPIE, Volume 7458
Physics
Scientific paper
Conventional space sensors have traditionally used CCD image sensors. Since CCD sensors provide analog output signals, the camera system has needed to integrate additional analog and digital circuitry including CCD drivers. The result is a camera that weighs more than 30 kg and dissipates more than 10 Watts of power. We report using an advanced semiconductor technology to integrate CMOS image sensors, analog and digital circuitry together into a single silicon chip. A Terrain Mapping Camera (TMC) was designed using this approach. The entire camera weighs less than 7 kg and dissipates only 1.8 Watts of power. The TMC was recently launched into moon orbit on October 22, 2008 aboard Chandrayaan-1. The image quality sent back from the TMC is excellent. Radiation testing of the digital image sensor was conducted prior to launch with the device enduring more than 300 kilo-rads.
Lin Chi-Pin
Lin Shengmin
Sikora Robert
Wang Weng-Lyang
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