Evaluation of the impact of solder die attach versus epoxy die attach in a state of the art power package

Details Evaluation of the impact of solder die attach versus epoxy die attach in a state of the art power package Evaluation of the impact of solder die attach versus epoxy die attach in a state of the art power package

2008-01-07

arxiv.org/abs/0801.1003v1

Dans 13th International Worshop on THERMal INvestigations of ICs and Systems - THERMINIC 2007, Budapest : Hongrie (2007)

Physics

General Physics

Submitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions)

Scientific paper

Subject of this paper is the thermal investigation of epoxy (EDA) and solder (SDA) die attaches by a comparison of an ASIC with multiple heat sources in different package assemblies. Static and transient thermal measurements and simulations were performed to investigate the thermal behavior of two samples in a state of the art QFP power package differing only in the die attach material (EDA and SDA).

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