Demonstration of fine pitch FCOB (Flip Chip on Board) assembly based on solder bumps at Fermilab

Details Demonstration of fine pitch FCOB (Flip Chip on Board) assembly based on solder bumps at Fermilab Demonstration of fine pitch FCOB (Flip Chip on Board) assembly based on solder bumps at Fermilab

2009-10-30

arxiv.org/abs/0911.0021v1

JINST 4:T11001,2009

Physics

Instrumentation and Detectors

4 pages, 8 figures

Scientific paper

10.1088/1748-0221/4/11/T11001

Bump bonding is a superior assembly alternative compared to conventional wire bond techniques. It offers a highly reliable connection with greatly reduced parasitic properties. The Flip Chip on Board (FCOB) procedure is an especially attractive packaging method for applications requiring a large number of connections at moderate pitch. This paper reports on the successful demonstration of FCOB assembly based on solder bumps down to 250um pitch using a SUESS MA8 flip chip bonder at Fermilab. The assembly procedure will be described, microscopic cross sections of the connections are shown, and first measurements on the contact resistance are presented.

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