Crack growth and reliability modeling of multi-layer capacitors in microelectronics applications

Details Crack growth and reliability modeling of multi-layer capacitors in microelectronics applications Crack growth and reliability modeling of multi-layer capacitors in microelectronics applications

Feb 2011

adsabs.harvard.edu/cgi-bin/nph-data_query?bibcode=2011spie.7928e..11s&link_type=abstract

Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices X. Edited by Garcia-Blanco, Sonia; Ramesham,

Physics

Scientific paper

Factors affecting the reliability of the ceramic dielectric body of multi layer ceramic capacitors (MLCCs) were explored for several capacitor sizes. Preliminary results indicate a correlation between the materials used for capacitor termination and the emergence of cracks. The authors varied the termination material, shape, and thickness of MLCCs. Under regimes in which boards were subjected to cyclic bending, vibrations, temperature cycling, and high-g loading, cracks have tended to appear on the bottom of the capacitor in proximity to the termination. Flexible termination materials corresponded to reduced crack formation at low strain rates.

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