Physics
Scientific paper
Oct 1996
adsabs.harvard.edu/cgi-bin/nph-data_query?bibcode=1996spie.2816..150f&link_type=abstract
Proc. SPIE Vol. 2816, p. 150-160, Infrared Detectors for Remote Sensing: Physics, Materials, and Devices, Randolph E. Longshore;
Physics
4
Scientific paper
Seven Aladdin sensor chip assemblies (SCAs) have been produced and nine more are in production. In this paper we cover the design, description, and measured performance of the Aladdin SCA. At over 7.5 square cm Aladdin is the largest single chip infrared array in use today. It is a hybrid assembly made up from an InSb detector coupled, via indium bumps, to a silicon readout. An array of this size is only possible because the InSb detector material is thinned to less than 10 microns which allows it to accommodate the InSb/silicon thermal mismatch. The Aladdin development program is a success and the resulting devices met most of the original design goals. Experience with Aladdin I led to improvements in the readout multiplexer design and, with these changes, we expect to meet the remaining goals. The new readouts have completed processing but testing has just started. The ALADDIN program is a joint collaboration between the National Optical Astronomy Observatories (NOAO) and the U.S. Naval Observatory (USNO) with Santa Barbara Research Center (SBRC).
Fowler Albert M.
Gatley Ian
Hoffman Alan W.
McIntyre Paul
Vrba Frederick J.
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