A Novel VLSI Technology to Manufacture High-Density Thermoelectric Cooling Devices

Details A Novel VLSI Technology to Manufacture High-Density Thermoelectric Cooling Devices A Novel VLSI Technology to Manufacture High-Density Thermoelectric Cooling Devices

2008-01-07

arxiv.org/abs/0801.0997v1

Dans 13th International Worshop on THERMal INvestigations of ICs and Systems - THERMINIC 2007, Budapest : Hongrie (2007)

Physics

General Physics

Submitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions)

Scientific paper

This paper describes a novel integrated circuit technology to manufacture high-density thermoelectric devices on a semiconductor wafer. With no moving parts, a thermoelectric cooler operates quietly, allows cooling below ambient temperature, and may be used for temperature control or heating if the direction of current flow is reversed. By using a monolithic process to increase the number of thermoelectric couples, the proposed solid-state cooling technology can be combined with traditional air cooling, liquid cooling, and phase-change cooling to yield greater heat flux and provide better cooling capability.

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