80-kelvin automated wafer testing of a 64x64-pixel-readout integratedcircuit

Details 80-kelvin automated wafer testing of a 64x64-pixel-readout integratedcircuit 80-kelvin automated wafer testing of a 64x64-pixel-readout integratedcircuit

Aug 1992

adsabs.harvard.edu/cgi-bin/nph-data_query?bibcode=1992spie.1683..168w&link_type=abstract

Proc. SPIE Vol. 1683, p. 168-177, Infrared Focal Plane Array Producibility and Related Materials, Raymond S. Balcerak; Paul W. P

Computer Science

Scientific paper

Hughes Aircraft Company has successfully demonstrated accurate, high-throughput, automated cryogenic wafer-level testing of a 64 X 64 readout integrated circuit (ROIC) for use in the Army's Advanced Anti-armor Weapon System-Medium (AAWS-M) program (contract #DAAH01-89-C-A012). Data acquired from our cryogenic wafer prober is compared to data acquired utilizing a standard 68-pin dewar. ROIC noise, transimpedance, transimpedance linearity, slew rate, data valid time, operating speed, and dynamic range test data are presented. Delivery system flow diagrams are presented to show the streamlining effect of cryogenic wafer probing on the ROIC test flow.

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