HgCdTe on SI for monolithic focal plane arrays

Physics

Scientific paper

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Scientific paper

HgCdTe was grown on Si substrates containing CCD and CMOS readout (R/O) circuits. Evaporated aluminum (Al) thin films were used to interconnect MWIR HgCdTe detector arrays with 1 X 64 scanned R/Os to demonstrate monolithic integration and eliminate indium bump bonds required to fabricate hybrid infrared focal plane arrays (IRFPAs). Conformal electroplated gold (Au) thin films on 32 X 64 staring arrays were used to integrate isolated MWIR HgCdTe detectors in each of the 100 micrometers X 100 micrometers unit cells to the input of the CMOS R/Os. Five micron wide Au thin films were used to make a conformal interconnect to 10 micrometers high HgCdTe layers in 40 micrometers X 40 micrometers unit cells within 256 X 256 arrays. Multiple thin film interconnects do not limit the size of the unit cell for dual band and multispectral staring arrays.

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